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High Temperature Electronics
Technical Resources

A number of applications today require electronics to operate in extremely harsh environment conditions. Operation temperature of 150°C and higher are required for energy exploration as well as other emerging applications such as geophysical services, avionics and industrial process control. Environments like these require electronics designed and manufactured specifically to withstand such temperature extremes.

With over 50 years experience in custom design and manufacturing of microelectronics, Vectron encompasses a blend of harsh environment electronic design and packaging expertise not common in the industry today. Our staff are experts in Hybrid Multi-Chip Modules, High Temperature and Harsh Environment Electronics for Deep Space to Deep Earth applications, Wafer Level Packaging, Physical Design Modeling, Finite Element Analysis, RF/signal conditioning, oscillator and digital embedded system designs.

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Additional Resources

High Temperature Crystal Oscillators
Specification # Standard Frequencies (MHz) Supply Voltage (V) Temperature Range (°C) Package Features
NEW
HX-171
10 / 20 5.0 –40 to 150 38 x 28 x 23 mm • High Temperature Stability; ±5ppb
• Aging: ±1.5ppb/day
VX-708 2 to 40 3.3 –55 to 180 5 x 7 x 1.95 mm
4 or 6 Pad
SMD
• Low jitter and phase noise
• Absolute VCXO Pull Range of ±25ppm
• Ruggedized 4–Point crystal mount for high shock & vibration
VX-400 1 to 32.768 3.3 / 5.0 –55 to 200 0.8" x 0.5" x .2" 4 pin DIP • Low jitter and phase noise
• Absolute VCXO Pull Range of ±25ppm or better for entire operating temperature range
• Ruggedized 4–Point crystal mount for high shock & vibration
PX-420 .500 to 40 3.3 / 5.0 –55 to 230 0.5" x 0.5" x .2" 4 pin ½DIP • Low jitter and phase noise
• Compliant crystal mount for high shock & vibration
PX-570 .500 to 40 1.8 / 2.5 / 3.3 / 5.0 –55 to 230 8 x 8.5 x 2.9 mm
Leaded Ceramic Package
• Low jitter and phase noise
• 3 Package lead options for Thru-hole and SMD
• Compliant crystal mount for high shock & vibration
PX-702 .500 to 40
*100 Design Avail.
1.8 / 2.5 / 3.3 / 5.0 –55 to 230 5 x 7 x 1.8 mm
4 or 6 Pad
SMD
• Small footprint and low profile
• Design for high shock & vibration
PX-610 .032768 to 40 1.8 / 2.5 / 3.3 / 5.0 –55 to 230 3 pin TO–39
0.38"Dia x 0.185"H
• Low jitter and phase noise
• Compliant crystal mount for high shock & vibration
• Low jitter and phase noise
NEW
HT-RTC-XO
Real Time Clock XO
.032768 1.8 / 2.5 / 3.3 / 5.0 –55 to 200 5 x 7mm – SMD
8 x 8.5mm – Leaded
0.5" x 0.5" – ½DIP
• Ultra low current consumption
• Tight temperature stability
• Reliable performance with bulk acoustic wave quartz resonator
HM-4201-RTCM1
Real Time Clock Module
.032768 2.7 / 3.6 –20 to 180 0.5" x 0.5" x 0.2" 8 pin – ½DIP • Built-In Tight Stability 32.768KHz Crystal Oscillator
• Timing, Calendar and Alarm functions set via I2C BUS
• Low current consumption
• Designed for high shock & vibration

Vectron offers several High Temperature Crystal Oscillator product platforms for extreme environment applications. Typical operating temperature range is from –55°C to +200°C. In addition, Vectron offers 0°C to 250°C High Temperature Crystal Oscillators for ultra HT applications to meet today's and future downhole tools requirements. Vectron's vertical integration in the following technical areas ensures the ability to design and manufacture state of the art High Temperature frequency control products:

• BAW & SAW Design & Fabrication to product
  high quality Quartz Resonators
• RF Oscillator Circuit Design
• High Temperature Packaging Expertise
• High Temperature Assembly & Test
  Expertise
• Environmental Screening

Photo of all the different packages sizes and types offered for this product platform

High Temperature Packaged Quartz Crystals

Specification # Frequency Range (MHz) Std Operating Temperature (°C) Shock Vibration Package Type Package Mounting Options
XR-R
(HC35/TO-5)
7 to 225 –55 to 200 100g, 6ms 20g, 10 to 2kHz HC–35/TO–5
0.200" to 0.265" tall
Thru-hole
XR-U
(HC37/TO-8)
2.5 to 140 –55 to 200 100g, 6ms 20g, 10 to 2kHz HC–37/TO–8
0.155" to 0.265" tall
Thru-hole
XR-B
(HC43)
2.2 to 210 –55 to 200 100g, 6ms 20g, 10 to 2kHz HC–43 Cold Weld
0.440" to 0.530" tall
Thru-hole
SMD
XR-A
(HC49)
2.2 to 210 –55 to 200 100g, 6ms 20g, 10 to 2kHz HC–43 Resistance Weld
0.440" to 0.530" tall
Thru-hole
SMD
XR-M
(HC45/HC52)
8 to 210 –55 to 200 100g, 6ms 20g, 10 to 2kHz HC–43 Resistance Weld
0.315" to 0.346" tall
Thru-hole
SMD
XR-P
(SM1/SQ580)
4.2 to 30 –55 to 200 100g, 6ms 10g, 10 to 2kHz 8.2 x 8.2 x 2.5mm SMD

Photo of all the different packages sizes and types offered for this product platform

• Frequencies from 2.20 MHz to 210 MHz
• Standard Operating Temperature Range:
   –55°C to 200°C (higher temperature ranges
  available)
• AT, SC, FC, AC and IT–cuts
• Swept Quartz–Lot Traceability available
• HFF Inverted Mesa AT–cut (NaOH Etch)
• All standard leaded cold weld and resistance
  weld holders
• Commercial and military operating
  environment
• Special shock and vibration capabilities
  available
• Low aging – world leader in some
  applications
• Low phase noise
• Low G–Sensitivity (<=2x10–10/g possible) :
  QRM Crystal


High Temperature Module Products

Let Vectron help to turn your product development project from circuit schematic that you provided into a fully functioning and high temperature capable end products to meet your application needs.

Extreme environment applications require electronic systems that are capable of surviving beyond the MIL–STD operating temperature range of –55°C to +125°C. Applications such as Deep Well Logging Tools (sensor, gauge and data acquisition etc.), Geothermal Logging, Light Weight Ground and Air Vehicles and Industrial Process Monitoring require robust electronic systems that can operate at 200°C and beyond. In addition, some of these applications also require survivability under high shock and vibration environments. Vectron's expertise readily handles such harsh environments. For example, our custom engineered High-temperature electronic modules have been qualified and deployed for 250°C+ "down hole" drilling/exploration applications.

• Extending device reliability and operating
  life at the field
• Eliminating the need for auxiliary cooling
  techniques such as massive heat sinks or
  elaborate heat pipe designs
• Lighter Weight and Smaller Size
• Integration of sensors and transducers along
  with electronics to operate reliably in
  high temperature environments